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Heat Transfer Analysis of Microchannel using Fluids
2020
International Journal of Engineering Research and
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In recent time due to high performance of electronic component the heat generation is increasing drastically. Due to this scenario heat dissipation becomes a major issue in efficiency promation and stable operation. Silicon based microchannel heat sink fabricated using semiconductor production technique plays important role in cooling devices. The effect of the thermophysical properties of working fluids on the performance of microchannel is tested or we can say investigated. For this purpose
doi:10.17577/ijertv9is070503
fatcat:vpvup5oksvgwxl4ulmo2wgmkji