The electroplating of copper on copper and steel surface was studied in absence and in presence of 6(2, 4-dimethoxyphenyl)-2-oxo-1,2, 3,4-tetrahydropyrimidine-5-carbonitrile [Compound I] and calcium bis- [(R)-3-(2, 4-dihydroxy-3, 3-dimethylbutyramido) propionate] (D-calcium pantothenate) [compound II] by measuring the limiting current. It is found that, the rate of plating depends on the concentration of CuSO4, types of organic additives and its concentrations, viscosity, density and types of

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... thode. It is found that the rate of electroplating increases by increase of concentration in case of electroplating of copper. The percentage of acceleration range from 15 to 60 % depend on organic additives and its concentration. In case of electroplating of steel the rate of deposition decreases and the percentage of inhibition ranged from 11.8 to 35.3 % depending on the type of organic additives and its concentrations. Langmuir and kinetic adsorption isotherm were studied.