Lead-free solder assembly: impact and opportunity

E. Bradley
53rd Electronic Components and Technology Conference, 2003. Proceedings.  
There has been major interest in Lead-free soldering within the electronics assembly industry for the last several years, and this will continue with the agreement on the language and implementation dates of the WEEE/ROHS legislation in the EU. This paper will focus on several topics critical to the implementation of lead-free soldering. These topics include the impact of Tin-silver-copper as the alloy of choice for leadfree assembly both with respect to component and solder joint reliability,
more » ... joint reliability, temperature exposure, and lead-free finishes. Results from the recently completed NEMI Lead-free Solder Project, the author's own work and other published data are discussed.
doi:10.1109/ectc.2003.1216254 fatcat:5y3ajhpxzvcg7f6wx4y6efuaxu