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53rd Electronic Components and Technology Conference, 2003. Proceedings.
There has been major interest in Lead-free soldering within the electronics assembly industry for the last several years, and this will continue with the agreement on the language and implementation dates of the WEEE/ROHS legislation in the EU. This paper will focus on several topics critical to the implementation of lead-free soldering. These topics include the impact of Tin-silver-copper as the alloy of choice for leadfree assembly both with respect to component and solder joint reliability,doi:10.1109/ectc.2003.1216254 fatcat:5y3ajhpxzvcg7f6wx4y6efuaxu