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Moisture Absorption in Uncured Underfill Materials

S. Luo, C.P. Wong
2004 IEEE transactions on components and packaging technologies  

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This paper presents a systematic study on moisture absorption in uncured underfill based on epoxy cured with acid anhydride [methylhexahydrophthalic anhydride (MHHPA)] and epoxy cured with non-acid anhydride curing agent. The influence of absorbed moisture on curing properties, thermomechanical property, and adhesion property of underfill after curing has been investigated. For epoxy cured with non-acid anhydride, the moisture absorption is low, and the absorbed moisture has no significant
more » ... t on the properties of cured underfill materials. For epoxy cured with acid anhydride, the moisture absorption before curing can be more than 2.0%, and the absorbed moisture can affect the properties significantly. The absorbed moisture can catalyze the curing reaction between acid anhydride and epoxy. The glass transition temperature of the cured samples is reduced after the underfill absorbs the moisture before curing. The adhesion strength decreases dramatically after the underfill absorbs the moisture before curing.
doi:10.1109/tcapt.2004.828562 fatcat:akwuappehvdillki4xipw35y7y
Citation

S. Luo, C.P. Wong. "Moisture Absorption in Uncured Underfill Materials." IEEE transactions on components and packaging technologies 27.2 (2004) 345-351