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Optimization of Thermal Aware VLSI Non-Slicing Floorplanning Using Hybrid Particle Swarm Optimization Algorithm-Harmony Search Algorithm
2016
Circuits and Systems
Floorplanning is a prominent area in the Very Large-Scale Integrated (VLSI) circuit design automation, because it influences the performance, size, yield and reliability of the VLSI chips. It is the process of estimating the positions and shapes of the modules. A high packing density, small feature size and high clock frequency make the Integrated Circuit (IC) to dissipate large amount of heat. So, in this paper, a methodology is presented to distribute the temperature of the module on the
doi:10.4236/cs.2016.75048
fatcat:yitpnapd7vbhlcrla627vkt4i4