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Nowadays, Lab On Chips (LOCs) require the development of new technologies in order to integrate complex fluidics, sensors, actuators... Such integration requires overcoming both technological bottlenecks and an increase in term of production cost. We propose a technique to manufacture reusable and complex LOCs made up of SU-8 resist for the fluidic structure, of glass for the hard packaging and are compatible with the integration of thick electrodes. The method is based on the combination ofdoi:10.1088/0960-1317/20/4/047001 fatcat:ndunitckangnjlsqibxazeow6y