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A technique to design complex 3D lab on a chip involving multilayered fluidics, embedded thick electrodes and hard packaging—application to dielectrophoresis and electroporation of cells
2010
Journal of Micromechanics and Microengineering
Nowadays, Lab On Chips (LOCs) require the development of new technologies in order to integrate complex fluidics, sensors, actuators... Such integration requires overcoming both technological bottlenecks and an increase in term of production cost. We propose a technique to manufacture reusable and complex LOCs made up of SU-8 resist for the fluidic structure, of glass for the hard packaging and are compatible with the integration of thick electrodes. The method is based on the combination of
doi:10.1088/0960-1317/20/4/047001
fatcat:ndunitckangnjlsqibxazeow6y