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Mechanics of Pb40/Sn60 near-eutectic solder alloys subjected to vibrations
1998
Applied Mathematical Modelling
Pb40/Sn60 is the most commonly used solder alloy for microelectronics packaging. It is well understood that, heat generated by the circuits when a semiconductor device is on and the coecient of thermal expansion mismatch between the soldered layers lead to the thermal fatigue of the solder joints. On the other hand, there is very little research done to understand failure mechanics of solder joints when microelectronics devices are subjected to vibrations. In this study, it is shown that
doi:10.1016/s0307-904x(98)10059-8
fatcat:reducrtydzc2plg55veh75izwm