Physical Design Automation Challenges for 3D ICs

S.S. Sapatnekar
2006 IEEE International Conference on IC Design and Technology  
Recent advances in process technology have brought forth several options that have brought three-dimensional (3D) circuits within the realm of the possible and probable. This new design paradigm will require a major change in design methodologies, and an optimal 3D design will look very different from an optimal 2D design. Since the move from conventional 2D to 3D is inherently a topological change, it stands to reason that a number of 3D-specific problems lie in the domain of physical design.
more » ... his paper addresses challenges related to physical design for 3D integrated circuits.
doi:10.1109/icicdt.2006.1669407 fatcat:vw533fyy2rdgbie2xq7vtczusa