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Physical Design Automation Challenges for 3D ICs
2006 IEEE International Conference on IC Design and Technology
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Recent advances in process technology have brought forth several options that have brought three-dimensional (3D) circuits within the realm of the possible and probable. This new design paradigm will require a major change in design methodologies, and an optimal 3D design will look very different from an optimal 2D design. Since the move from conventional 2D to 3D is inherently a topological change, it stands to reason that a number of 3D-specific problems lie in the domain of physical design.
doi:10.1109/icicdt.2006.1669407
fatcat:vw533fyy2rdgbie2xq7vtczusa