Practices in Testing of Mixed-Signal and RF SoCs
14th Asian Test Symposium (ATS'05)
Due to advances in processing technology, modern Systems-on-chip (SoC) devices can incorporate highspeed digital, memory, analog, and RF circuits on a single chip. This high integration of components makes SoC testing complex and costly. Conventional ATE testing for mixed-signal and RF devices requires the use of dedicated and expensive analog resources. Analog and RF testing poses major challenges that have yet to be surmounted. There are several reasons for the inherent complexity of analog
... d RF testing: a lack of analog fault models hinders structural testing approaches, and there is no coverage metric in place for analog and RF testing. Currently within the industry, analog and RF functional testing to specification is carried out to ensure that DPM goals are being met. This testing approach is increasingly expensive and is fast becoming impractical. Analog and RF DFT is an alternative approach for testing these products. Typically, analog and RF DFT techniques are restricted in their application to a specific class of circuits based on their unique characteristics. A number of alternative test solutions have been implemented or suggested within the industry and academia. These techniques greatly rely upon DFT and BIST structures to improve testability, reduce test generation cost, and reduce test application times. The presentation includes an overview of challenges in testing analog, mixed signal, and RF SoCs, and presents alternative solutions to ATE functional testing for products that are suitable for high volume manufacturing. This talk presents a different level of granularity within mixed signal SoC testing by abstracting the systems in terms of product types, specifications, interfaces, or building blocks. This way, the final testing of the SoC becomes an aggregation of the test techniques targeted for particular product types, interfaces, and building blocks incorporated in the system. Several industrial examples of production testing of mixed-signal and RF devices are presented in this talk.