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The Influence of Missing Contacts in Back Contact Modules
Back contact cells and modules using the metal wrap through technology (MWT) in conjunction with conducting Back Contact Foils (BCF) have recently gained a lot of interest in the industry. This technology does not suffer from some of the most severe failure mechanisms in standard modules, like e.g. breakage in the stringing process. Nevertheless, a specific potential failure mechanism in Back Contact Foil based modules are failing solder connections. In the present work the influence of suchdoi:10.1016/j.egypro.2012.07.131 fatcat:ybhvafss5rdepnh4vjbchn2go4