A copy of this work was available on the public web and has been preserved in the Wayback Machine. The capture dates from 2018; you can also visit the original URL.
The file type is application/pdf.
Connection Reliability of SnAgCu Solder Bump on Electroless CuNiP
無電解CuNiPのSnAgCuはんだバンプ接続信頼性
2008
Journal of The Japan Institute of Electronics Packaging
無電解CuNiPのSnAgCuはんだバンプ接続信頼性
Preserved Fulltext
A low-cost method for the electroless deposition of CuNiP without Au surface finishing has been developed with highly reliable under-bump metallization (UBM). When SnAgCu solder was connected to an electroless CuNiP alloy containing 45% Cu, formations of (Ni,Cu)3Sn4, Ni3P, Kirkendall void, and Au-Sn alloy did not occur. Consequently, this enabled a reliable and long-lasting connection for 750 hours at 175°C. The electroless CuNiP can be firmly connected to SnAgCu solder using active flux. The
doi:10.5104/jiep.11.292
fatcat:ntq2k5ttdngora3t45tbaedm4e