Due to its good properties, stainless steel is a promising material to be used as substrate for the development of large size flexible display, and the chemical mechanical polishing (CMP) is one of the most practical processing technologies to be used to achieve the surface of the stainless steel materials with highly smooth surface and without damage. In this paper, the authors have investigated the influence of the pH value and the pH value regulator on the material removal rate (MRR) and

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... ace roughness by using the CMP technology with the ferric chloride based polishing slurry. The experimental results show that the MRR increased with the decrease of the pH value and the surface roughness decreased with the decrease of the pH value. Under the experimental conditions, when pH=2, the MRR reached the maximum. The different pH regulator has the different influence on the material removal rate and surface roughness. Under the same conditions, it can achieve the maximum material removal rate and low surface roughness when adjusting the pH value of the slurry using the oxalic acid. So the best pH value regulator is the oxalic acid. These research results in this paper can provide a reference for further research on chemical mechanical polishing the 304 stainless steel.