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Printed Circuit Boards (PCBs) are widely used in electronic goods and many applications that require microprocessor controls. The need to increase the population density of components on PCBs, to make the products ever smaller, has driven the move to more complex surface mount assembly technology. This has led to increased use of area array components such as Ball Grid Arrays (BGAs) and other small footprint devices. As a result there are greater demands on Non Destructive Testing (NDT)doi:10.1108/03056120710836927 fatcat:lu43mmzfcfalnbnlj335xrfd4e