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2015 International Conference on Electronic Packaging and iMAPS All Asia Conference (ICEP-IAAC)
MEMS (Micro Electro Mechanical System) Motion sensor such as Accelerometer and Gyroscope are composed by MEMS die which manufactured by surface micromachining process and signal processing die which is made by standard CMOS process. These two types of dies are assembled in single package of plastic mold called LGA. Current standard products have almost 3x3mm square package size for Accelerometer, and 4x4mm or less for gyroscope and combo of accelerometer and gyroscope. To realize smallerdoi:10.1109/icep-iaac.2015.7111057 fatcat:fan2vvef6rhutnexk5h4tqgvzq