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A small-scale phase change material (PCM)-based heat sink can regulate the temperature of electronics due to high latent-heat capacity. Three different heat sinks are examined to study the effects of PCM combination, arrangement of PCMs in multiple-PCM heat sink, PCM thickness, melting temperature and intensity of heat source on the thermal behavior of heat sink. Results are obtained for the temperature distribution across the heat sink and the PCM melting profile. It is concluded that (i) PCMdoi:10.3390/en11071629 fatcat:sylgrouy4jcoxgdk33q7npi6qm