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MATERIAL REMOVAL MODE IN 3D MICRO USM
2019
MM Science Journal
Ultrasonic machining (USM) is known for its ability of processing brittle and hard materials such as silicon, glass and quartz. Usually, material removal in conventional USM is in brittle mode. The machined surface is covered with sharp tips and edges. In micro USM, the size of machined feature is less than 1 mm. Different from the conventional USM, in micro USM, it was found that the machined surface is flat and smooth under certain machining conditions. This indicates that the ductile
doi:10.17973/mmsj.2019_11_2019050
fatcat:l3y5phmwrndxja3iqzbrf3fsca