A copy of this work was available on the public web and has been preserved in the Wayback Machine. The capture dates from 2017; you can also visit the original URL.
The file type is
ISIE '97 Proceeding of the IEEE International Symposium on Industrial Electronics
This paper describes the development of a microinstrumentation system in silicon containing all the components of the data acquisition system, such as sensors, signal-conditioning circuits, analog-digital converter, interface circuits, sensor bus interface, and an embedded microcontroller (MCU). The microinstrumentation system is to be fabricated using the Multi-Chip-Module (MCM) technology based on a chip-level infrastructure. A standard silicon platform is the floorplan for individual smartdoi:10.1109/isie.1997.648651 fatcat:adbdjtiwqvfjvgohnrxpaqt6cu