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Optical Microlithography X
The problem of accurately describing the topography of a mask arose in x-ray lithography, where the absorber structures have dimensions of several hundred wavelengths and may have topography. However, the application of phase shifting structures and a refinement of the image formation calculation even in optical masks has recently raised the same issue for the case of optical lithography. This paper reports the design and implementation of Topography Description Model (TDM), a rule-based 3Ddoi:10.1117/12.276038 fatcat:yuqi5pfqwzfsbixzpq5mfdhtzm