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The 13th International Conference on Solid-State Sensors, Actuators and Microsystems, 2005. Digest of Technical Papers. TRANSDUCERS '05.
This study has successfully demonstrated a process to localize, assemble and weld microstructures using an external magnetic field. The primary three merits of this technology are as follows. (1) The magnetic field is not only to assemble the microstructures but also to fix them by induction welding. (2) The assembly and welding can be localized by the magnetic film. However, a global wafer level process can be achieved by the magnetic field. (3) It is easy to tune the heating temperature bydoi:10.1109/sensor.2005.1496614 fatcat:smvrm25hyjfglo72lbjyn3c2o4