Wafer level self-assembly of microstructures using the global magnetic lifting and localized induction welding

Hsuch-An Yang, Chiung-Wen Lin, Weileun Fang
The 13th International Conference on Solid-State Sensors, Actuators and Microsystems, 2005. Digest of Technical Papers. TRANSDUCERS '05.  
This study has successfully demonstrated a process to localize, assemble and weld microstructures using an external magnetic field. The primary three merits of this technology are as follows. (1) The magnetic field is not only to assemble the microstructures but also to fix them by induction welding. (2) The assembly and welding can be localized by the magnetic film. However, a global wafer level process can be achieved by the magnetic field. (3) It is easy to tune the heating temperature by
more » ... g temperature by varying the area of the magnetic film; in other words, photolithography can define various temperature regions on a substrate.
doi:10.1109/sensor.2005.1496614 fatcat:smvrm25hyjfglo72lbjyn3c2o4