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Effects of the initial stress at the bottom of open TSVs

Santo Papaleo, Wolfhard H. Zisser, Hajdin Ceric
2015 2015 IEEE 22nd International Symposium on the Physical and Failure Analysis of Integrated Circuits  

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In this work we have studied delamination in Open Through Silicon Vias structures under different initial stress loads. The study has been carried out by means of simulation which is based on the evaluation of the J integral for different interfaces. Our simulations enabled us to determine the structures with the lowest failure probability.
doi:10.1109/ipfa.2015.7224429 fatcat:kryxs652hfeivbim3bwkzsy2um
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Santo Papaleo, Wolfhard H. Zisser, Hajdin Ceric. "Effects of the initial stress at the bottom of open TSVs." 2015 IEEE 22nd International Symposium on the Physical and Failure Analysis of Integrated Circuits (2015)