A copy of this work was available on the public web and has been preserved in the Wayback Machine. The capture dates from 2018; you can also visit the original URL.
The file type is application/pdf.
Annaniah L, Devarajan M. "Investigation on Thermal Resistance of Cracked AlInGaP Die Substrate and In-line Die Crack Testing Method." Journal of Lasers Optics & Photonics 03.02 (2016)