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We report poly͑ethyleneimine͒ ͑PEI͒ as a possible passivating agent for Ta during chemical mechanical planarization ͑CMP͒. Studies by electrochemical impedance spectroscopy in a model CMP slurry suggest that PEI forms a polymer film atop a Ta electrode, and voltammetry studies of Ta in 2.5 M HF suggest that PEI films suppress the formation of Ta oxide. Because Ta oxide is mechanically hard, suppressing Ta oxide growth may allow reduced downforce or higher removal rates. These observations aredoi:10.1149/1.3489072 fatcat:txmm47ngknd5lejm3r3yuv6w5q