Precise Estimation of Propagation Constants of a Microstrip Line Based on Material Constants Measured for Copper-Clad Laminate Substrate
銅張り誘電体積層基板に関する材料定数の測定結果を用いたマイクロストリップ線路の伝搬定数の高精度評価

Ryohei Yoshitomi, Yoshio Kobayashi, Zhewang Ma
2011 Journal of The Japan Institute of Electronics Packaging  
doi:10.5104/jiep.14.114 fatcat:25vhzm7w2jhmbl6zhygqfbk6xq