Joint exploration of architectural and physical design spaces with thermal consideration

Yen-Wei Wu, Chia-Lin Yang, Ping-Hung Yuh, Yao-Wen Chang
2005 Proceedings of the 2005 international symposium on Low power electronics and design - ISLPED '05  
Heat is a main concern for processors in deep sub-micron technologies. The chip temperature is affected by both the power consumption of processor components and the chip layout. Therefore, for thermal-aware design it is crucial to consider the thermal effects of different floorplans during micro-architectural design space exploration. In this paper, we propose a thermal-aware architectural floorplanning framework. With the aid of this framework, an architect can explore both physical and
more » ... ectural design spaces simultaneously to find an architecture and the corresponding chip layout that maximizes performance under a thermal limitation.
doi:10.1145/1077603.1077636 dblp:conf/islped/WuYYC05 fatcat:aq5eijo47fanhi5n6cjxqgwvtu