Comparative Study of Chloride and Fluoride Induced Aluminum Pad Corrosion in Wire-Bonded Device Packaging Assembly

Goutham Issac Ashok Kumar, Alexander Lambert, Joshua Caperton, Muthappan Asokan, William Yi, Oliver Chyan
2021 Corrosion and Materials Degradation  
The introduction of copper as wire bonding material brings about a new challenge of aluminum bond pad bimetallic corrosion at the copper/aluminum galvanic interface. Aluminum is well known to undergo pitting corrosion under halide-contaminated environments, even in slightly acidic conditions. This paper aims to study the corrosion morphology and progression of aluminum influenced by different halide contaminations in the presence and absence of galvanic contact with copper. We used a new
more » ... on characterization platform of the micropattern corrosion screening to simulate the copper wire bonding on the aluminum bond pad. The corrosion screening data and subsequent SEM–EDX analyses showed a striking difference in morphology and progression between chloride-induced and fluoride-induced aluminum corrosion. The corrosion products formed play a vital role in the resulting morphology and in sustaining further aluminum corrosion.
doi:10.3390/cmd2030023 fatcat:r52dzwh46fh75ebljflyywiny4