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Comparative Study of Chloride and Fluoride Induced Aluminum Pad Corrosion in Wire-Bonded Device Packaging Assembly
Corrosion and Materials Degradation
The introduction of copper as wire bonding material brings about a new challenge of aluminum bond pad bimetallic corrosion at the copper/aluminum galvanic interface. Aluminum is well known to undergo pitting corrosion under halide-contaminated environments, even in slightly acidic conditions. This paper aims to study the corrosion morphology and progression of aluminum influenced by different halide contaminations in the presence and absence of galvanic contact with copper. We used a newdoi:10.3390/cmd2030023 fatcat:r52dzwh46fh75ebljflyywiny4