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Studies on the Flux Action of Soldering (VI)
軟ろう付用フラックスの作用機構に関する研究(第6報)
1974
JOURNAL OF THE JAPAN WELDING SOCIETY
軟ろう付用フラックスの作用機構に関する研究(第6報)
In previous paper, the flux action of various inorganic metal salts (chloride, sulfate and nitrate) for soldering was reported about the relation between the reaction of flux with molten Sn solder and spreadabi lity of Sn solder on Cu plate. In this report, authors have studied the relation between the reaction of base plate (Ni, Fe) or Sn solder with flux and spreading phenomenon of Sn solder on Fe plate or Ni plate in the case of various silver salts and copper salts as flux. The results
doi:10.2207/qjjws1943.43.1205
fatcat:4q7agzfnlvaw7aotkxcukxdxri