Copper Pattern Formation by Modified Semi-Additive Process using Silver Nano-particles Seed Layer

村川 昭, 深澤 憲正, 冨士川 亘, 白髪 潤
2018 MES  
We propose novel Modified Semi-Additive Process (MSAP) using silver nanoparticles layer as a conductive seed. It was found that the rectanglar shape of the copper wiring was maintained even after etching process by selective Ag seed etching. The copper wiring obtained in this process has a smooth surface on all four sides.
doi:10.11486/mes.28.0_285 fatcat:lfbpbwajdzba5fl5xlnvwdhxqu