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Copper Pattern Formation by Modified Semi-Additive Process using Silver Nano-particles Seed Layer
銀ナノ粒子を下地としたセミアディティブ法による銅パターン形成技術
2018
MES
銀ナノ粒子を下地としたセミアディティブ法による銅パターン形成技術
Preserved Fulltext
We propose novel Modified Semi-Additive Process (MSAP) using silver nanoparticles layer as a conductive seed. It was found that the rectanglar shape of the copper wiring was maintained even after etching process by selective Ag seed etching. The copper wiring obtained in this process has a smooth surface on all four sides.
doi:10.11486/mes.28.0_285
fatcat:lfbpbwajdzba5fl5xlnvwdhxqu