Intel, Hillsboro, OR CMOS technology scaling continues to drive higher levels of integration in VLSI design, which adds more compute engines on a die. To meet the overall performance-scaling needs, high-speed and high-bandwidth memory is becoming increasingly important. Conventional VLSI systems often rely on ondie SRAMs to address the performance gap between CPU and main memory, DRAM. However, with the rapid growth in capacity needs for high-performance memory, SRAM is not always sufficient to

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... meet the demands of bandwidthintense applications. Embedded DRAM (eDRAM) has been explored as an alternative to satisfy the high-performance and density needs in memory [1-3]. In this paper, a high-performance eDRAM based on a 22nm tri-gate CMOS technology is introduced. This eDRAM technology enables the integration of an eDRAM cell into the logic technology platform [4] . The design features a well-balanced configuration to achieve both optimal array efficiency and bandwidth. By leveraging the high-performance and low-voltage tri-gate transistor at 22nm generation, the eDRAM achieves a wide range in operating voltage, from 1.1V down to 0.7V, which is essential for low-power logic applications.