Electronic device integrated with LTCC temperature stabilizer
Acknowledgements The work was co-financed by the European Union within the European Social Fund. The authors would like to thank Roman Stępiński for measurements carried out in a climatic chamber and Bartosz Płatek for IR camera measurements. Calculations have been carried out in Wroclaw Centre for Networking and Supercomputing (www.wcss.wroc.pl), Grant No. 259. Dominik Jurków -received an M.Sc. degree in electronics and telecommunications in 2008 from Wrocław University of Technology, Poland.
... echnology, Poland. Since 2007 he has been working in the field of thick-film hybrid microelectronics and sensors in a research and development team at Wrocław Grzegorz Lis -received an M.Sc. degree in automatics and robotics in 1994 from Wrocław University of Technology, Poland. Since then he was working as programmer, constructor and project manager. He is recently director of operation of Becker Electronics Poland Sp. Z o.o. Abstract Purpose -Some electronics circuits have to work properly at ambient temperature below -55°C. Therefore, temperature conditioning is necessary in such applications. The application of Low Temperature Cofired Ceramics (LTCC) technology in control of very low temperatures is presented in this paper. The aim of the work was to check if LTCC technique can be used to 'This article is , paper has been published in final form at http://www.emeraldinsight.com/journals.htm?articleid=17076672 reduce the power consumption of the temperature conditioning and to present other benefits of the method. Design/methodology/approach -Low Temperature Cofired Ceramics (LTCC) technology was applied in the fabrication of temperature regulator integrated with multilayer ceramic substrate. Temperature uniformity on LTCC substrates were improved by heaters topology optimization. Temperature distribution on the ceramic substrate and temperature stabilization time were analyzed using an IR camera. The heating ability of the heater was tested in a climatic chamber. Influence of force convection and thermal isolation thickness of electronics on maximal temperature of thermally stabilized electronics was investigated using numerical modeling. Findings -The integrated device ensures proper temperature conditions of electronic components if the ambient temperature is lower than -40°C. The device can reduce power consumption needed to ensure proper temperature conditions of electronic components. Research limitations/implications -The achieved results is just a research part of the work. Further experiments will be needed to improve structural drawbacks and to analyze precisely the device reliability and parameters repeatability. Practical implications -The device presented in the paper can be applied in systems working at very low ambient temperatures (below -55°C). Moreover, a temperature stabilizer can increase the temperature of the whole device above -40°C, therefore, standard electronic components (which can work down to -40°C) can be used instead of specialized ones (which can work below -40°C). Originality/value -This paper presents the novel temperature stabilizer.