High Frequency Ultrasonic Transducers for Interconnection Microwelding in Electronic Devices

Igor B. Petukhov, Vladimir L. Lanin
2015 International Journal of Scientific Research in Knowledge  
Ultrasonic (US) microwelding is widely used in electronic production to generate the electrical connections between contact pads of a die and package leads. This type of bonding is highly automated and universal to different geometrical sizes of packages. High frequency US transducers are more effective for ultra fine pitch connectors. The technique of analytical simulation allows calculating high frequency US transducers parameters for microwelding and high-density wire joints in 3Dgeneration
more » ... ts in 3Dgeneration integrated circuits. Analytic calculation method of US transducers was offered: resonance frequency, geometric parameters of frequency-lowering pads with error less than 5-6%. For finite rating of US converters characteristic it is recommended to use of laser vibrometer, which allows measurement of spectrum and amplitude of mechanical fluctuations.
doi:10.12983/ijsrk-2015-p0241-0246 fatcat:nqwhkm6hvvcehfkzg3w4k4u2pu