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Excitation and transmission of vibration inside electronic packages are strongly connected with mechanical characteristics of their enclosure, which are in the objective for the current research aimed at developing methods and means to reduce vibration inside the enclosure case. The main idea of the introduced methods is in creating elastic and dissipative mechanical joints between structural elements, which appear to be the links for vibration transmission, inside and outside of the electronicdoi:10.1051/matecconf/201930201008 fatcat:ecktbim7lffgppwedkld4vzpam