In this work the physical and mechanical properties for epoxy resin improvement by addition the particle of Copper(Cu) and Silicon (Si). Copper (Cu) and silicon (Si) powders strengthened epoxy resin was worked to research the action of powders respect to the mechanical properties such as (hardness and impact strength)and physical properties such as (thermal and electrical conductivity) for epoxy resin. Cu and Si powders were inserted to the matrix material as filler with increasing in weight

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... io (2%, 4%, 6% &8%). These properties were estimated and compared. The Experimental results show that the hardness enhancement increased gradually with increase weight fraction for the particles silicon until 4%and then begin descend, in other words, should not exceed the proportion of silicon added to the epoxy resin 4% in order to get an improvement in the hardness of epoxy, While increasing the proportion of copper particles added to the epoxy resin more than 4% lead to increased hardness of the resin. The impact resistance increases for epoxy resin to add silicon particles and copper but be better resistance at the rate of 8% Cu, where). The thermal conductivities increased with increasing of 2 s (14J/m) while you are adding 8% copper and up to les 2 up to (32.5 J/m). As well as the electrical 1-Copper (25 w/m.c the and) 1-(24.65 w/m.c Silicon for be content fillers Si and Cu for weight ratio conductivity increased with increasing the weight fraction for the Silicon and Copper (σ=0.87 s/m) and (σ=0.967 s/m).