A copy of this work was available on the public web and has been preserved in the Wayback Machine. The capture dates from 2018; you can also visit the original URL.
The file type is
On a Paradoxical Situation Related to Bonded Joints: Could Stiffer Mid-Portions of a Compliant Attachment Result in Lower Thermal Stress?
Journal of Solid Mechanics and Materials Engineering
The objective of the analysis is to find out to what extent the thermal stress in a bonded assembly could be reduced as a result of employing a compliant bonding layer with an interfacial compliance varying along the assembly. It has been determined that by employing such a layer one can achieve in an assembly of any size a low stress level and the same type of the stress distribution that takes place in a small size assembly: the interfacial shearing stress changes linearly along the assemblydoi:10.1299/jmmp.3.990 fatcat:gxfa2xy5hfc37dftjasqaddfce