Effect of Feed Substrate Thickness on the Bandwidth and Radiation Characteristics of an Aperture-Coupled Microstrip Antenna with a High Permittivity Feed Substrate

Jae-Hyun Kim, Boo-Gyoun Kim
2018 Journal of the Korean Institute of Electromagnetic Engineering and Science  
The impedance bandwidth and radiation characteristics of an aperture-coupled microstrip line-fed patch antenna (ACMPA) with a high permittivity (εr = 10) feed substrate suitable for integration with a monolithic microwave integrated circuit (MMIC) are investigated for various feed substrate thicknesses through an experiment and computer simulation. The impedance bandwidth of an ACMPA with a high permittivity feed substrate increases as the feed substrate thickness decreases. Furthermore, the
more » ... Furthermore, the front-to-back ratio of an ACMPA with a high permittivity feed substrate increases and the cross-polarization level decreases as the feed substrate thickness decreases. As the impedance bandwidth of an ACMPA with a high permittivity feed substrate increases and its radiation characteristics improve as the feed substrate thickness decreases, the ACMPA configuration becomes suitable for integration with an MMIC. This is an Open-Access article distributed under the terms of the Creative Commons Attribution Non-Commercial License (http://creativecommons.org/licenses/by-nc/4.0) which permits unrestricted non-commercial use, distribution, and reproduction in any medium, provided the original work is properly cited. ⓒ
doi:10.26866/jees.2018.18.2.101 fatcat:pxktxw54dneepizhpchysmhkha