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A Scalable and Low Stress Post-CMOS Processing Technique for Implantable Microsensors
2020
Micromachines
Implantable active electronic microchips are being developed as multinode in-body sensors and actuators. There is a need to develop high throughput microfabrication techniques applicable to complementary metal–oxide–semiconductor (CMOS)-based silicon electronics in order to process bare dies from a foundry to physiologically compatible implant ensembles. Post-processing of a miniature CMOS chip by usual methods is challenging as the typically sub-mm size small dies are hard to handle and not
doi:10.3390/mi11100925
pmid:33028005
pmcid:PMC7600457
fatcat:rpofj6reefdkxblciwv4c7diga