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Handbook of Algorithms for Physical Design Automation
We survey recent research and practice in the area of chemical-mechanical polishing (CMP) fill synthesis, in terms of both problem formulations and solution approaches. We review the CMP as the planarization technique of choice for multilevel very large-scale integration metallization processes. Post-CMP wafer topography varies according to pattern density. We review density-analysis methods and density-control objectives that are used in today's fill-synthesis algorithms. In addition, wedoi:10.1201/9781420013481.ch36 fatcat:5u2ufr4ulrfybau7lhky3i7u6q