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Kinetic Properties of the Passive Film on Copper in the Presence of Sulfate-Reducing Bacteria
2018
Journal of the Electrochemical Society
Copper specimens were exposed to Sulfate-Reducing Bacteria (SRB) for 10 months under the conditions corresponding to the final disposal of high-level nuclear waste. In-situ electrochemical impedance spectroscopy (EIS) measurements were carried out to characterize the surface-environment interface after various times of exposure. The EIS results are interpreted in terms of the Point Defect Model (PDM), in order to obtain kinetic information on the formation of the Cu 2 S passive film. The
doi:10.1149/2.007189jes
fatcat:sgrnfehoprhobnwyxuk3ihgawe