Heat transfer enhancement by coated fins in the microscale domain

Rajasekaran Thanigaivelan, Devarajan Deepa
2017 Thermal Science  
Original scientific paper https://doi.org/10.2298/TSCI160901089T Micro-fins configuration is considered as a capable cooling method for microelectronic components due to its space optimization and types of heat transfer. In this study micro-fins profile is selected according to the type of heat transfer and fabricated on copper and aluminum materials through wire-cut electric discharge machining process. The four numbers of square test pieces of dimensions of 4.5 cm × 4.5 cm and fin height, H,
more » ... and fin height, H, of 0.25 mm with different spacing, S, of 3.75 mm and 5 mm are considered for the experimentation. The fabricated test pieces such as aluminum, copper, painted aluminum, and painted copper are used in this experiments. This paper aims to improve the convective heat transfer coefficient by applying aluminum paint coating on a micro-fin structure. The paint coated copper test piece produces 20.62% higher heat transfer compared to aluminum test piece. On comparing the aluminum with aluminum paint coated test piece, the convective heat transfer rate found to increase by 49%. Coated aluminum test piece with 3.75 mm and 5 mm spacing shows higher radiation heat transfer compared to other micro-fin structures.
doi:10.2298/tsci160901089t fatcat:zsoasfboovhodlzl5imhfkdvva