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Beetle Inspired Electrospray Vapor Chamber
ASME 2009 Second International Conference on Micro/Nanoscale Heat and Mass Transfer, Volume 3
We present the proof-of-concept for a biomimetic electrospray vapor chamber (BEVAC) which can potentially eliminate the wick structures and thermal interface materials used in conventional vapor chambers, and enable direct cooling of the backside of a microprocessor. This vapor chamber has a beetle-inspired superhydrophobic condenser with hydrophilic bumps on which condensate of the working fluid accumulates. The condensate is returned to the evaporator by electrostatic forces (electrospraydoi:10.1115/mnhmt2009-18498 fatcat:ouzgi347ofdhfeeca6smgfstta