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Electroless Copper Plating on the Insulating Resin for Build-up Process Using TiO2 as a Photocatalyst
光触媒としてTiO2を用いたビルドアップ法による絶縁材料への無電解銅めっき

Takeshi BESSHO, Kotoku INOUE, Kumiko ISHIKAWA, Ichiro KOIWA, Hideo HONMA
2006 Journal of The Surface Finishing Society of Japan  

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doi:10.4139/sfj.57.157 fatcat:wvbgps7fz5bjzldkit7dqg2n3y
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Takeshi BESSHO, Kotoku INOUE, Kumiko ISHIKAWA, Ichiro KOIWA, Hideo HONMA. "Electroless Copper Plating on the Insulating Resin for Build-up Process Using TiO2 as a Photocatalyst." Journal of The Surface Finishing Society of Japan 57.2 (2006) 157-161