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After etching Al-Cu alloy films using SiCl4/Cl2/He/ CHF3 mixed gas plasma, the corrosion phenomenon at the grain boundary of the etched surface and a passivation layer on the etched surface with an SF6 plasma treatment subsequent to the etching were studied. In Al-Cu alloy system, corrosion occurs rapidly on the etched surface by residual chlorine atoms, and it occurs dominantly at the grain boundaries rather than the crystalline surfaces. To prevent corrosion, the SF6 gas plasma treatment subsdoi:10.4218/etrij.99.0199.0303 fatcat:cvqluddlazeorklfuepw47ouhm