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The chip is the core component of the integrated circuit. Degradation and failure of chip solder joints can directly lead to function loss of the integrated circuit. In order to establish the degradation model of chip solder joints under coupled stress, this paper takes quad flat package (QFP) chip solder joints as the study object. First, solder joint degradation data and failure samples were obtained through fatigue tests under coupled stress. Three types of micro failure modes of solderdoi:10.3390/ma13081813 pmid:32290574 fatcat:i3irfv7razaubfxgqwjmx5ofzm