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Residual Stress Measurement with Laser-Optical and Mechanical Methods
2014
Advanced Materials Research
A new approach in hole-drilling residual stress analysis is described, applying a laser for quasi non-destructive material removal by laser ablation and measuring simultaneously the residual deformation around the hole by means of high-resolution, digital holographic interferometry. To evaluate this technology, experiments measuring well-defined in-plane stresses in curved strip specimen, on experimental bending device based on the European Standard for four-point bending tests, were carried
doi:10.4028/www.scientific.net/amr.996.256
fatcat:36bjlcwowrctpeyci3k6d6srye