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In this contribution numerical simulation of Young's modulus of copper-polymer composites is presented. For the simulation of the composites the Bonded-Particle-Model was applied. The model allows representing of the structure of composite materials realistically. The polymer matrix, which surrounds the particles, was represented as network of solid bonds connecting copper particles. Simulation results were validated based on mechanical determination of modulus of elasticity. The modulus ofdoi:10.1051/epjconf/201714013005 fatcat:6bgmkddagbhtnfoe5fxiacvea4