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Alternative materials for use in electronic devices have grown interest in the past recent years. In this paper, the heterojunction SnO 2 /Al 2 O 3 is tested concerning its use as a transparent insulating layer for use in FETs. The alumina layer is obtained by thermal annealing of metallic Al layer, deposited by resistive evaporation technique. Combination of undoped SnO 2 , deposited by sol-gel-dip-coating technique, and Al thermally annealed in O 2 -rich atmosphere, leads to fair insulationdoi:10.1590/1516-1439.285114 fatcat:x5rv22hwp5gzbaxlqfqqyvifb4