This paper presents the potential application of AC coupled interconnect (ACCI) for dense three-dimensional (3-D) integrated circuits (ICs). The concept of inductive ACCI for 3-D ICs has been proposed. Combined with the "through vias" technology, inductive ACCI can provide small pitch vertical interconnects, as well as an excellent thermal solution for dense 3-D ICs. Transformer modeling and transceiver circuit design have also been investigated. Simulations predict that, for 20 m thinned die

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... acks coupled by a 100 m diameter transformer, the transceiver circuit fed with a 5 Gbps data stream consumes 14.5 mW power. Index Terms-AC coupled, inductive coupling, spiral inductor, three-dimensional integrated circuits (3-D ICs), through vias, vertical interconnect.