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publicado na web em 28/04/2015 THERMAL EVALUATION OF CURING OF SBR BASED ADHESIVES USING DICUMYL PEROXIDE. Curing is an important process in adhesive formulation, but scant reports on the study of the kinetics of curing in adhesive are currently available, particularly for formulations including styrene-butadiene copolymers. The focus of the present work was to thermodynamically quantify the curing reaction in pressure-sensitive adhesives (PSA) obtained from styrene-butadiene copolymers, thedoi:10.5935/0100-4042.20150067 fatcat:lcv46d4c3racxcjrbmctonk2zq