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LED arrays with pixel numbers of 3×3, 4×4, and 5×5 have been studied in this paper in order to enhance the optical output power and decrease heat dissipation of an AlGaInP-based light emitting diode display device (pixel size of 280×280 µm) fabricated by micro-opto-electro-mechanical systems. Simulation results showed that the thermal resistances of the 3×3, 4×4, 5×5 arrays were 52°C/W, 69.7°C/W, and 84.3°C/W. The junction temperature was calculated by the peak wavelength shift method, whichdoi:10.3807/copp.2017.1.2.143 fatcat:ynssqeuqrfe3hktn73b5cdhzsy