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This paper presents a thermal analysis and experimental validation of natural convective heat transfer of a high-brightness light-emitting diode (LED) package assembly. The substrate materials used in the LED package assembly were filled and doped using boron nitride (BN) filler. The thermal conductivity of the BN-filled substrate was measured. The temperature distribution and heat flow of the LED package were assessed by thermal profile measurement using an infrared (IR) camera anddoi:10.1364/ao.52.008484 pmid:24513891 fatcat:zvjqfb3o6bfwhchwvwavas7dwm