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Advances in LIGA-based post mold fabrication
Micromachining and Microfabrication Process Technology IV
The establishment of a process to allow planarization of deep x-ray lithography based microfabricated metal components via diamond lapping has enabled examination of three additional microfabrication issues. The areas of improvement that are discussed include materials, microassembly and packaging, and multilevel fabrication. New materials work has centered on magnetic materials including precision micromagnets and surface treatments of electrodeposited materials. Assembly and packaging hasdoi:10.1117/12.324299 fatcat:6tt2h4ccozcrfm23agi57ya4u4